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Technical Manufacturing Corporation is fully
equipped with automatic and semi-automatic placement equipment and
staffed with trained and experienced personnel to handle all of
your most advanced plated through hole and surface mount technology printed
circuit board assembly requirements.
We manufacture all assemblies in strict accordance with any
class of the Acceptability of Electronic Assemblies (IPC-A-610)
and Requirements for Soldered Electrical and Electronic Assemblies
(J-STD-001) commercial industry specifications and maintain complete lines of assembly, inspection,
cleaning and electrical & functional testing equipment to ensure
finished product conformance to industry specifications and customer requirements.
Our printed circuit board assembly capabilities
can provide you with immediate prototype turnaround and on-time
delivery of small to large production volumes for any single- or
double-sided printed circuit board configuration, including plated
through hole, surface mount and mixed technology on a repeatable
zero-defect production level.
In addition, we also offer interconnecting wire & cable
harness assembly and system integration to our customers to
supplement and complement our core printed circuit board assembly
services.
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- Rigid and flexible printed circuit board fabrications
- FR-4, High Tg, Thermal Clad, aluminum & exotic
laminate processing
- Lead-free, leaded, white tin, silver, gold and OSP circuit board
platings
- Populate all component types including
ball grid arrays (BGA) and quad flat packages (QFP)
- Minimum 12
mil pitch and 0201 component package size placement
- Single or double sided printed circuit
board assemblies
- Lead-free and leaded
soldering processes
- No-clean and water soluble soldering
- Complete electrical (ICT) and functional testing
- EPROM programming, calibration and burn-in
- Conformal coating with parylene, acrylic, silicone and urethane materials
- Encapsulate and potting in assembly housings
- Ionic Chromatography (IC) cleanliness testing and full
reporting
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