Technical Manufacturing Corporation is fully equipped with automatic and semi-automatic placement equipment and staffed with trained and experienced personnel to handle all of your plated through hole and surface mount technology printed circuit board assembly requirements.

We manufacture all products in accordance with Acceptability of Electronic Assemblies commercial industry specifications (all classes) and maintain complete lines of assembly, inspection, cleaning and electrical & functional testing equipment to ensure finished product conformance to industry specifications and customer requirements.

Our printed circuit board assembly capabilities can provide you with immediate prototype turnaround and on-time delivery of small to large production volumes for any single- or double-sided printed circuit board configuration, including plated through hole, surface mount and mixed technology on a repeatable zero-defect production level.

In addition, we also offer interconnecting wire & cable harness assembly and system integration to our customers to supplement and complement our core printed circuit board assembly services.

Contact your local sales representative or our Sales Department by calling us toll-free at (888) TECH MFG or by email at sales@techmfgcorp.com for more information on our complete line of contract electronics manufacturing services.

• Rigid and flexible printed circuit board fabrications (FR-4, IS410, Rogers, Thermal Clad & others)
• Lead-free, leaded, white tin, silver & gold plated circuit board fabrications
• Populate all component types including ball grid arrays (BGA) and quad flat packages (QFP)
• Capacity in excess of 30,000 CPH at 15 mil fine pitch and 0201 or larger component packages
• Populate single or double sided printed circuit board assemblies
• Lead-free and leaded soldering processes
• No-clean and water soluble wave and reflow solder processing
• Complete electrical and functional testing
• EPROM programming, calibration and burn-in
• Conformal coating with acrylic, silicone and urethane materials
• Encapsulate and potting in assembly housings