Technical Manufacturing Corporation maintains a modern state of the art facility that is fully equipped with automatic and semi-automatic placement equipment and staffed with trained and experienced personnel to handle all of your most advanced single or double-sided plated through hole and surface mount technology printed circuit board (PCB) or metal core (MCPCB) printed circuit board assembly requirements.

SPECIFICATION CAPABILITY
STYLES RIGID, FLEX & RIGID-FLEX
CONFIGURATIONS SINGLE AND DOUBLE SIDED
TECHNOLOGIES SURFACE MOUNT, THOUGH HOLE AND MIXED
BUILD CLASS CLASS 3 & SPACE ADDENDUM
PROTOTYPE VOLUMES 1 PIECE MINIMUM
PRODUCTION VOLUMES 100-5000 PCS TYPICAL
EXPEDITED LEAD TIMES 1, 2, 3 AND 4 WEEKS AVAILABLE
STANDARD LEAD TIMES 6 TO 8 WEEKS TYPICAL
STANDARD SUBSTRATES FR4, FR406, FR408, IS410, 370HR, NELCO & ROGERS
METAL CORE SUBSTRATES BERGQUIST, THERMAGON, ARLON & DENKA
SPECIAL SUBSTRATES CERAMIC, POLYIMIDE, TEFLON & ALUMINUM
OUTSIDE DIMENSIONS 18" BY 26" MAXIMUM
FABRICATION LAYERS 32 LAYERS MAXIMUM
FINISHED THICKNESS 0.010" TO 0.200"
COPPER WEIGHT 0.25 TO 200 OZ
TRACE/SPACE WIDTH 2/2 MILS MINIMUM
ELECTRICAL ATTRIBUTES CONTROLLED DIELECTRIC & IMPEDANCE 
PHYSICAL ATTRIBUTES PLATED SLOTS & FINGERS, BORES, SINKS & HOLES
ADVANCED ATTRIBUTES BLIND/BURIED VIAS, MICRO VIAS & VIA-IN-PAD
SURFACE FINISHES BARE, HASL, OSP, TIN, NICKEL, SILVER & GOLD
SOLDER MASKS GRN, BLK, BLU, RED, WHT, CLEAR & CUSTOM
PACKAGE SIZES 0201 MINIMUM
SPECIAL PACKAGES FLIP CHIP, QUAD FLAT PACK & BALL GRID ARRAY
COMPONENT PREPARATION ROBOTIC HOT SOLDER DIP (RHSD) REPLATING
LEAD PITCH 10 MIL MINIMUM
SOLDERING PROCESSES LEADED & LEAD-FREE (ROHS)
SOLDERING CHEMISTRIES NO-CLEAN AND WATER SOLUBLE
CLEANING PROCESSES AQUEOUS CLEANING
SPECIAL PROCESSES IONIC CHROMATOGRAPHY CLEANLINESS TESTING
SERIALIZATION STANDARD & CUSTOMER SPECIFIC
TRACEABILITY TWO-WAY LOT CODE COMPONENT CONTROL
TESTING ELECTRICAL (ICT) & FUNCTIONAL
DEVICE PROGRAMMING AVAILABLE FOR ALL COMPONENT PACKAGES
CONFORMAL COATINGS PARYLENE, EPOXY, ACRYLIC, SILICONE & URETHANE
SECONDARY PROCESSES ENCAPSULATION, STAKING, UNDERFILL & POTTING

Our printed circuit board assembly capabilities can provide you with immediate prototype turnaround and on-time delivery of production volumes for any single- or double-sided printed circuit board configuration, including plated through hole, surface mount and mixed technology on a repeatable zero-defect production level. We manufacture all printed circuit board assemblies in strict accordance with the Acceptability of Electronic Assemblies (IPC-A-610) and the Requirements for Soldered Electrical and Electronic Assemblies (J-STD-001) specifications, including the space applications electronic hardware addendum. We maintain complete lines of assembly, inspection, cleaning and electrical & functional testing equipment to ensure finished product conformance to industry specifications and customer requirements.